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Ti Substrate | Stainless Substrate | Pi Substrate

Rolling Coil,  Rolling Sheet, Rolling Foil

The mass production of rolling coils or rolling sheets ensuring their high purity and quality.


Ti Substrate

The physical property of titanium ( Ti ) are as below:

  • High melting point: 1,668℃( above the ones of Fe )

  • Light weight ( approx. 60% of Fe, 1.7 of Al )

  • Low coefficient of thermal expansion (approx.half of stainless steel, 1/3 of aluminium )

  • Low coefficient of heat conduction: 0.041cal/c㎡/sec/℃/cm ( the same as stainless steel 18-8 )

  • High resistivity: 55μΩ-cm (higher resistivity compared with pure metals excluding stainless steel 18-8 )

  • Magnetic permeability 1.0001 is nonmagnetic material.

  • Below transformation point of crystalollne structure ( 885℃ ) is closed-packed hexagonal system. Above it is body-centered cubic structure.

  • Low modulus of longitudinal elasticity: 10,850kg/mm2 (approx. half of Fe, 1.5 of Al.



Stainless substrate

鈦基板 / 不鏽鋼基板

Improved material for solar cell (DS9 Coil trial samples): 

鈦基板 / 不鏽鋼基板

Chemical Composition

SUS430

DS9

C: 0.12max

C: 0.02max(0.006)

Si: 0.75max

Si: 0.5max(0.2)

Mn: 1.00max

Mn: 0.5max(0.2)

P: 0.040max

P: 0.04max(0.025)

S: 0.030max

S: 0.03max(0.005)

Ni: 0.60max

Cr: 7.0 ~ 9.9(9.4)

Cr: 16.00 ~ 18.00

Cu: 1.0max(0.4)


PI 特性



PI substrate

PI characteristics

outstanding mechanical characteristics

high tensile strength and modulus


Electrical  characteristics
Wide temperature range, good maintenance of frequency cycle


Thermal property
High heat resistance

Low heating shrinkage rate and high dimension stability


Chemical property
High tolerance

PI 特性


PI Thermal expansion coefficient change

The coefficient of thermal expansion of PI is close to the ones of Si thin film solar battery and CIGS solar battery. Other thermal expansivities can be also developed according to customers’ requirements.


The possibility of operability and product features compatibility is improved because of the compatibility between the thickness and low thermal expansion coefficients.

Properties

Test Items

Units

NT-025

NT-050

NT-075

Test Condition

Test Method

Mechanical

Thickness

μm

25

50

75

-

-

Tensile Strength


Kgf/mm2

28

28

25

20℃

ASTM D882

Elongation

%

80

80

80

20℃

ASTM D882

Young's Modulus

Kgf/mm2

340

340

320

20℃

ASTM D882

Electrical


Dielectric Breakdown Voltage

KV/mil

5.8

3.4

2.5

60Hz, 20℃

ASTM D149

Dielectric Constant

-

3.2

3.2

3.2

1MHz, 20℃

ASTM D150

Dissipation Factor

-

0.007

0.007

0.007

1MHz, 20℃

ASTM D150

Volume Resistivity

Ω?cm

>1016

>1016

>1016

500V, 20℃

ASTM D257

Surface Resistance

Ω

>1016

>1016

>1016

500V, 20℃

ASTM D257

Thermal


Coefficient of Thermal Expansion

ppm/℃

<35

<35

<35

100~200℃

ASTM D696

Heat Shrinkage

%

<0.05

<0.05

<0.05

200℃, 2hr

ASTM D5213-04

Glass Transition Temperature(Tg)

>380

>380

>380

-

DMA

TMT Method

Physical


Moisture Absorption

%

2.5

2.5

2.5

20℃, 24hr Immersion

ASTM D570

Density

g/cc

1.46

1.46

1.46

20℃

ASTM D1505

Chemical


MEK丁

Tensile Strength MD Retained

%


100

100

100

20℃, 10 min Immersion, then test after 24 hrs.


ASTM D882

Benzene

100

100

100

Toluene

100

100

100

Methanol

100

100

100

Acetone

96

96

96

10%HCl

96

96

96

10%H2SO4

98

98

98

5%NaOH

85

85

85

FeCl3

94

94

94

CuCl2

79

79

79


Any interest, please leave your contact info. We will feedback ASAP.


NEXTECK is committed to solar photovoltaic supply for many years. We have established long-term cooperative relations with many well-known solar PV manufacturers. Our products are exported to many countries in Europe and Southeast Asia . NEXTECK provides safe and convenient PV connectors which are certified by German TUV .


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